NSP8814 Datasheet, PDF (6/7 Pages) ON Semiconductor – Transient Voltage Suppressors

NSP8814, NSP8818
PACKAGE DIMENSIONS
UDFN8 2.2x2, 0.575P
CASE 506CV
ISSUE A
D
AB
PIN ONE
REFERENCE
ÇÇÇÇÇÇ _{2X 0.10 C}
E
2X
0.10 C _{TOP VIEW}
0.05 C
9X
0.05 C
DETAIL B
SIDE VIEW
(A3)
A1
L
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTION
A3
EXPOSED Cu
MOLD CMPD
ÉÇÉÇÉÇ ÉÇÇÉÇÇ _A
A1
DETAIL B
ALTERNATE
CONSTRUCTIONS
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 MM FROM TERMINAL TIP.
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D
2.20 BSC
E
2.00 BSC
E3
0.20 BSC
e
0.575 BSC
e2
0.40 BSC
L 0.25 0.35
L1 0.05 0.15
L2 0.95 1.05
RECOMMENDED
E3
MOUNTING FOOTPRINT
e
e2
DETAIL A
1
10X b
0.10 M C A B
4
0.05 M ^{C NOTE 3}
0.575
PACKAGE
OUTLINE
0.20
0.40
2.30
8X L
2X L2
8
5
e2
e
E3
BOTTOM VIEW
4X 0.50 ¹
0.40
6X
0.22
0.575
0.20
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
6