CM1230_12 Datasheet, PDF (7/8 Pages) ON Semiconductor – Low-Capacitance ESD Protection Array

CM1230
PACKAGE DIMENSIONS
D
PIN A1
ÈÈÈÈ ^REFERENCE
2X
0.05 C
AB
WLCSP4, 0.96x0.96
CASE 567CS
ISSUE O
E
2X
0.05 C _{TOP VIEW}
A2
0.05 C
A
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.61 0.69
A1 0.21 0.28
A2
0.41 REF
b 0.29 0.34
D
0.96 BSC
E
0.96 BSC
e
0.50 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
4X b
0.05 C A B
B
0.03 C
A
e
e
12
BOTTOM VIEW
0.50
PITCH
4X
0.25
0.50
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
PIN A1
REFERENCE
D
ÈÈ
2X
0.05 C
WLCSP6, 1.46x0.96
CASE 567BB
ISSUE O
AB
E
2X
0.05 C
TOP VIEW
OptiGuard Option
A2
ÉÉÉÉ 0.05 C
A
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.56 0.72
A1 0.21 0.27
A2
0.42 REF
b 0.29 0.35
D
1.46 BSC
E
0.96 BSC
e
0.50 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
6X b
0.05 C A B
B
0.03 C
A
e
e
123
BOTTOM VIEW
0.50
PITCH
0.50
6X 0.25
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
7