CM1230_12 Datasheet, PDF (6/8 Pages) ON Semiconductor – Low-Capacitance ESD Protection Array

CM1230
APPLICATION INFORMATION
Table 5. PRINTED CIRCUIT BOARD RECOMMENDATIONS
Parameter
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance − Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous
Maximum Soldering Temperature for Lead−free Devices using a Lead−free Solder Paste
Value
0.275 mm
Round
Non−Solder Mask defined pads
0.325 mm Round
0.125 − 0.150 mm
0.330 mm Round
50/50 by volume
No Clean
OSP (Entek Cu Plus 106A)
±50 mm
±20 mm
60 seconds
260°C
Non−Solder Mask Defined Pad
0.275 mm DIA.
Solder Stencil Opening
0.330 mm DIA.
Solder Mask Opening
0.325 mm DIA.
Figure 5. Recommended Non−Solder Mask Defined Pad Illustration
Figure 6. Lead−free (SnAgCu) Solder Ball Reflow Profile
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