MC74LVX541_11 Datasheet, PDF (6/7 Pages) ON Semiconductor – Octal Bus Buffer

MC74LVX541
PACKAGE DIMENSIONS
SOIC−20
CASE 751D−05
ISSUE G
D
A
20
11
E
1
10
20X B
B
0.25 M T A S B S
18X e
A
SEATING
PLANE
A1 _T
q
C
NOTES:
1. DIMENSIONS ARE IN MILLIMETERS.
2. INTERPRET DIMENSIONS AND TOLERANCES
PER ASME Y14.5M, 1994.
3. DIMENSIONS D AND E DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.
5. DIMENSION B DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF B
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
MILLIMETERS
DIM MIN MAX
A 2.35 2.65
A1 0.10 0.25
B 0.35 0.49
C 0.23 0.32
D 12.65 12.95
E 7.40 7.60
e
1.27 BSC
H 10.05 10.55
h 0.25 0.75
L 0.50 0.90
q
0_{_} 7_{_}
20
1
Z
D
e
b
0.13 (0.005) M
11
E H_E
10
A
A₁
0.10 (0.004)
SOEIAJ−20
CASE 967−01
ISSUE A
L_E
M_
VIEW P
L
DETAIL P
Q₁
c
NOTES:
  1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
  2. CONTROLLING DIMENSION: MILLIMETER.
  3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
  4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
  5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION AT MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
MILLIMETERS
DIM MIN MAX
A
--- 2.05
A_{1 0.05 0.20}
b 0.35 0.50
c 0.15 0.25
D 12.35 12.80
E 5.10 5.45
e
1.27 BSC
H_{E 7.40 8.20}
L 0.50 0.85
L_E 1.10 1.50
M
0 _ 10 _{_}
Q₁ 0.70 0.90
Z
--- 0.81
INCHES
MIN MAX
--- 0.081
0.002 0.008
0.014 0.020
0.006 0.010
0.486 0.504
0.201 0.215
0.050 BSC
0.291 0.323
0.020 0.033
0.043 0.059
0 _ 10 _{_}
0.028 0.035
--- 0.032
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