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PACVGA200_11 Datasheet, PDF (5/8 Pages) ON Semiconductor – VGA Port Companion Circuit
PACVGA200
Table 4. ELECTRICAL OPERATING CHARACTERISTICS (Note 1)
Symbol
Parameter
Conditions
Min
Typ
Max
Units
IOFF Off−State Leakage Current,
Level−Shifting NFET
(VCC2 − VDDC_IN)  0.4 V,
VDDC_OUT = VCC2
(VCC2 − VDDC_OUT)  0.4 V,
VDDC_IN = VCC2
10
mA
10
VON Voltage Drop Across Level
VCC2 = 2.5 V, VS = GND, IDS = 3 mA
Shifting NFET when Turned ON
0.15
V
CIN
Input Capacitance
VIDEO_1,VIDEO_2 & VIDEO_3 VCC1 = 5.0 V, VIN = 2.5 V,
Inputs
Measured at 1 MHz
VCC1 = 2.5 V, VIN = 1.25 V,
Measured at 1 MHz
pF
3.0
4.0
5.0
3.0
4.5
5.6
tPLH
SYNC Drivers L  H Propagation CL = 50 pF, VCC = 5.0 V,
Delay
Input tR and tF  5 ns
tPHL
SYNC Drivers H  L Propagation CL = 50 pF, VCC = 5.0 V,
Delay
Input tR and tF  5 ns
8.0
12.0
ns
8.0
12.0
ns
tR, tF
SYNC Drivers Output Rise & Fall
Times
CL = 50 pF, VCC = 5.0 V,
Input tR and tF  5 ns
(Measured 10% − 90%)
5.0
7.0
10.0
ns
VESD ESD Withstand Voltage
VCC1 = VCC3 = VCC4 = 5 V (Note 3)
8
kV
1. All parameters specified over standard operating conditions unless otherwise noted.
2. This parameter applies only to the HSYNC and VSYNC channels. HSYNC and VSYNC have 8 mA drivers with RS added in series to
terminate transmission line.
3. Per the IEC−61000−4−2 International ESD Standard, Level 4 contact discharge method. VCC1, VCC3 and VCC4 must be bypassed to GND
via a low impedance ground plane with a 0.2 mF, low inductance, chip ceramic capacitor at each supply pin. ESD pulse is applied between
the applicable pins and GND. ESD pulse can be positive or negative with respect to GND. Applicable pins are: VIDEO_1, VIDEO_2,
VIDEO_3, SYNC_OUT1, SD1, SYNC_OUT2, SD2, DDC_OUT1 and DDC_OUT2. All other pins are ESD protected to the industry standard
2 kV per the Human Body Model (MIL−STD−883, Method 3015).
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