PACDN1408CG Datasheet, PDF (4/5 Pages) ON Semiconductor – ESD Protection Arrays in Chip Scale Package

PACDN1404
PACKAGE DIMENSIONS
WLCSP6, 1.80x1.15
CASE 567BD−01
ISSUE O
PIN A1
REFERENCE
ÈÈ ^D
2X
0.05 C
2X
0.05 C
TOP VIEW
0.05 C
0.05 C
NOTE 3 _A1
SIDE VIEW
AB
E
A2
A
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO SPHERICAL
CROWNS OF SOLDER BALLS.
MILLIMETERS
DIM MIN MAX
A 0.60 0.69
A1 0.23 0.29
A2
0.38 REF
b 0.34 0.39
D
1.80 BSC
E
1.15 BSC
e
0.65 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
6X b
0.05 C A B
B
0.03 C
e
e
A
1
2
3
BOTTOM VIEW
0.65
PITCH
6X
0.25
0.65
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
http://onsemi.com
4