PACDN1408CG Datasheet, PDF (3/5 Pages) ON Semiconductor – ESD Protection Arrays in Chip Scale Package

PACDN1404
APPLICATION INFORMATION
Parameter
Pad Size on PCB
Pad Shape
Pad Definition
Solder Mask Opening
Solder Stencil Thickness
Solder Stencil Aperture Opening (Laser Cut, 5% Tapered Walls)
Solder Flux Ratio
Solder Paste Type
Pad Protective Finish
Tolerance − Edge To Corner Ball
Solder Ball Side Coplanarity
Maximum Dwell Time Above Liquidous (183C)
Maximum Soldering Temperature for Lead−free Devices Using a Lead−free Solder Paste
Value
0.240 mm
Round
Non−Solder Mask Defined Pads
0.290 mm Round
0.125 mm − 0.150 mm
0.300 mm Round
50/50 by Volume
No Clean
OSP (Entek Cu Plus 106A)
50 mm
20 mm
60 seconds
260C
Non−Solder Mask Defined Pad
0.240 mm DIA.
Solder Stencil Opening
0.300 mm DIA.
Solder Mask Opening
0.290 mm DIA.
Figure 1. Recommended Non−Solder Mask Defined Pad Illustration
250
200
150
100
50
0
1:00.0
2:00.0
3:00.0
Time (minutes)
4:00.0
Figure 2. Lead−free (SnAgCu) Solder Ball Reflow Profile
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