MC74VHC259_14 Datasheet, PDF (4/8 Pages) ON Semiconductor – 8-Bit Addressable Latch/1-of-8 Decoder CMOS Logic Level Shifter

MC74VHC259
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
V_CC
V_IN
V_OUT
I_IK
I_OK
I_OUT
I_CC
P_D
Positive DC Supply Voltage
Digital Input Voltage
DC Output Voltage
Input Diode Current
Output Diode Current
DC Output Current, per Pin
DC Supply Current, V_CC and GND Pins
Power Dissipation in Still Air
−0.5 to +7.0
V
−0.5 to +7.0
V
−0.5 to V_CC +0.5
V
−20
mA
$20
mA
$25
mA
$75
mA
SOIC Package
200
mW
TSSOP
180
T_STG
V_ESD
Storage Temperature Range
ESD Withstand Voltage
−65 to +150
°C
Human Body Model (Note 1.)
>2000
V
Machine Model (Note 2.)
>200
Charged Device Model (Note 3.)
>2000
I_{LATCH−UP} Latch−Up Performance
Above V_CC and Below GND at 125°C (Note 4.)
$300
mA
q_JA
Thermal Resistance, Junction to Ambient
SOIC Package
143
TSSOP
164
°C/W
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Tested to EIA/JESD22−A114−A
2. Tested to EIA/JESD22−A115−A
3. Tested to JESD22−C101−A
4. Tested to EIA/JESD78
RECOMMENDED OPERATING CONDITIONS
Symbol
Characteristics
Min
Max
Unit
V_CC
DC Supply Voltage
2.0
5.5
V
V_IN
DC Input Voltage
0
5.5
V
V_OUT
DC Output Voltage
0
V_CC
V
T_A
Operating Temperature Range, all Package Types
−55
125
°C
t_r, t_f
Input Rise or Fall Time
V_CC = 3.3 V + 0.3 V
0
V_CC = 5.0 V + 0.5 V
20
ns/V
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
DEVICE JUNCTION TEMPERATURE VERSUS
TIME TO 0.1% BOND FAILURES
Junction
Temperature °C
80
90
100
110
120
130
140
Time, Hours
1,032,200
419,300
178,700
79,600
37,000
17,800
8,900
Time, Years
117.8
47.9
20.4
9.4
4.2
2.0
1.0
FAILURE RATE OF PLASTIC = CERAMIC
UNTIL INTERMETALLICS OCCUR
1
1
10
100
1000
TIME, YEARS
Figure 5. Failure Rate vs. Time Junction Temperature
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