MC74LVX50_14 Datasheet, PDF (4/9 Pages) ON Semiconductor – Hex Buffer

MC74LVX50
50%
A
t_PLH
50% V_CC
Y
V_CC
GND
t_PHL
Figure 3. Switching Waveforms
DEVICE
UNDER
TEST
TEST POINT
OUTPUT
C_L*
*Includes all probe and jig capacitance
Figure 4. Test Circuit
INPUT
Figure 5. Input Equivalent Circuit
EMBOSSED CARRIER DIMENSIONS (See Notes 9 and 10)
Tape B₁
Size Max
D
D₁
E
F
K
P
P₀
P₂
R
T
W
8 mm 4.35 mm
(0.179”)
12 mm 8.2 mm
(0.323”)
1.5 mm
+ 0.1
−0.0
(0.059”
+0.004
−0.0)
1.0 mm
Min
(0.179”)
1.5 mm
Min
(0.060)
1.75 mm
±0.1
(0.069
±0.004”)
3.5 mm
±0.5
(1.38
±0.002”)
5.5 mm
±0.5
(0.217
±0.002”)
2.4 mm
Max
(0.094”)
6.4 mm
Max
(0.252”)
4.0 mm
±0.10
(0.157
±0.004”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
4.0 mm
±0.1
(0.157
±0.004”)
2.0 mm
±0.1
(0.079
±0.004”)
25 mm
(0.98”)
30 mm
(1.18”)
0.6 mm
(0.024)
8.3 mm
(0.327)
12.0 mm
±0.3
(0.470
±0.012”)
16 mm 12.1 mm
(0.476”)
7.5 mm
±0.10
(0.295
±0.004”)
7.9 mm
Max
(0.311”)
4.0 mm
±0.10
(0.157
±0.004”)
8.0 mm
±0.10
(0.315
±0.004”)
12.0 mm
±0.10
(0.472
±0.004”)
16.3 mm
(0.642)
24 mm 20.1 mm
(0.791”)
11.5 mm
±0.10
(0.453
±0.004”)
11.9 mm
Max
(0.468”)
16.0 mm
±0.10
(0.63
±0.004”)
24.3 mm
(0.957)
9. Metric Dimensions Govern−English are in parentheses for reference only.
10. A₀, B₀, and K₀ are determined by component size. The clearance between the components and the cavity must be within 0.05 mm min to
0.50 mm max. The component cannot rotate more than 10° within the determined cavity
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