KAE02150 Datasheet, PDF (39/40 Pages) ON Semiconductor – Interline CCD Image Sensor

KAE−02150
Notes:
1. Die is standard thickness for 150 mm silicon wafer: 0.675 ± 0.020 mm.
2. Singulated die is approximately 12.910 × 8.500 mm, for a 50 micron saw kerf.
3. The optical center of the image area is at the center of the die and the center of the package.
Figure 43. Completed Assembly (2/2)
www.onsemi.com
39