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MT9D115 Datasheet, PDF (32/66 Pages) ON Semiconductor – CMOS Digital Image Sensor
MT9D115: 1/5-Inch SOC Digital Image Sensor
Architecture
Output Interface from IFP
The output interface contains parallel image bus, MIPI serial bus interfaces, and walking
1s connectivity test generator.
Parallel and MIPI Output
The user can select to use either the serial MIPI output or the 10-bit parallel output to
transmit the data. Only one of the output modes can be used at any time.
The parallel output can be used with an output FIFO whose memory is shared with the
MIPI output FIFO to retain a constant pixel output clock independent from the scaling
factor.
When scaling the image or skipping lines, the data would be generated in bursts and the
pixel clock would turn on and off in intervals, which might lead to EMI problems. The
output FIFO will group all active pixel data together so the pixel clock can be run at a
constant speed.
The MIPI output transmitter implements a serial differential sub-LVDS transmitter
capable of up to 512 Mb/s. It supports multiple formats, error checking, and custom
short packets. The MIPI clock is defined as half the data rate frequency.
The virtual channel could be used by host MIPI RX circuits to differentiate between
preview and capture image data if the FW changes the channel number when switching
between contexts. The host cannot adequately time this switching of contexts and so
cannot use channel number in this way without FW support.
The hardware supports a configurable MIPI virtual channel in the MIPI Control register
(R0x3400). Firmware provides two variables that allow the MIPI virtual channel to be
changed according to context (preview/A, capture/B). The host can specify what
channel is used for which context through these variables.
Table 8:
Data Formats Supported by MIPI Interface
Note:
Data Format
YUV 422 8-bit
565RGB
555RGB
444RGB
RAW8
RAW10
Data Type
0x1E
0x22
0x21
0x20
0x2A
0x2B
Data will be packed as RAW8 if the data type specified does not match any of the above data
types.
MT9D115 DS Rev. E Pub. 4/15 EN
32
©Semiconductor Components Industries, LLC,2015.