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MC74HC595A_16 Datasheet, PDF (3/13 Pages) ON Semiconductor – 8-Bit Serial-Input/Serial or Parallel-Output Shift Register
MC74HC595A
MAXIMUM RATINGS
Symbol
Parameter
Value
Unit
VCC DC Supply Voltage (Referenced to GND)
–0.5 to +7.0
V
Vin DC Input Voltage (Referenced to GND)
–0.5 to VCC+0.5 V
Vout DC Output Voltage (Referenced to GND)
–0.5 to VCC+0.5 V
Iin
DC Input Current, per Pin
±20
mA
Iout DC Output Current, per Pin
±35
mA
ICC DC Supply Current, VCC and GND Pins
±75
mA
PD Power Dissipation in Still Air,
SOIC Package†
500
mW
TSSOP Package†
450
Tstg Storage Temperature
–65 to +150 _C
TL Lead Temperature, 1 mm from Case for 10 Seconds
_C
(Plastic DIP, SOIC or TSSOP Package)
260
VESD ESD Withstand Voltage Human Body Model (Note 1)
> 3000
V
Machine Model (Note 2)
> 400
Charged Device Model (Note 3)
N/A
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any
of these limits are exceeded, device functionality should not be assumed, damage may occur
and reliability may be affected.
†Derating: SOIC Package: –7 mW/_C from 65_ to 125_C
TSSOP Package: −6.1 mW/_C from 65_ to 125_C
1. Tested to EIA/JESD22−A114−A.
2. Tested to EIA/JESD22−A115−A.
3. Tested to JESD22−C101−A.
This device contains protection
circuitry to guard against damage
due to high static voltages or electric
fields. However, precautions must
be taken to avoid applications of any
voltage higher than maximum rated
voltages to this high−impedance cir-
cuit. For proper operation, Vin and
Vout should be constrained to the
range GND v (Vin or Vout) v VCC.
Unused inputs must always be
tied to an appropriate logic voltage
level (e.g., either GND or VCC).
Unused outputs must be left open.
RECOMMENDED OPERATING CONDITIONS
Symbol
Parameter
VCC DC Supply Voltage (Referenced to GND)
Vin, Vout DC Input Voltage, Output Voltage
(Referenced to GND)
Min
Max
Unit
2.0
6.0
V
0
VCC
V
TA Operating Temperature, All Package Types
–55
+125
_C
tr, tf Input Rise and Fall Time
(Figure 1)
VCC = 2.0 V
0
VCC = 4.5 V
0
VCC = 6.0 V
0
1000
ns
500
400
Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond
the Recommended Operating Ranges limits may affect device reliability.
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