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CAT34TS02_13 Datasheet, PDF (3/20 Pages) ON Semiconductor – Digital Output Temperature Sensor with On-board SPD EEPROM
CAT34TS02
Table 5. A.C. CHARACTERISTICS (VCC = 3.3 V ± 10%, TA = −20°C to +125°C) (Note 4)
Symbol
Parameter
Min
Max
Units
FSCL (Note 5)
Clock Frequency
10
400
kHz
tHIGH
High Period of SCL Clock
600
ns
tLOW
Low Period of SCL Clock
1300
ns
tTIMEOUT (Note 5)
SMBus SCL Clock Low Timeout
25
35
ms
tR (Note 6)
SDA and SCL Rise Time
300
ns
tF (Note 6)
SDA and SCL Fall Time
300
ns
tSU:DAT (Note 7)
Data Setup Time
100
ns
tSU:STA
START Condition Setup Time
600
ns
tHD:STA
START Condition Hold Time
600
ns
tSU:STO
STOP Condition Setup Time
600
ns
tBUF
Bus Free Time Between STOP and START
1300
ns
tHD:DAT
Input Data Hold Time
0
ns
tDH (Note 6)
Output Data Hold Time
200
900
ns
Ti
Noise Pulse Filtered at SCL and SDA Inputs
100
ns
tWR
Write Cycle Time
5
ms
tPU (Note 8)
Power−up Delay to Valid Temperature Recording
100
ms
4. Timing reference points are set at 30%, respectively 70% of VCC, as illustrated in Figure 23. Bus loading must be such as to allow meeting
the VIL, VOL as well as the various timing limits.
5. For the CAT34TS02 Rev. B, the TS interface will reset itself and will release the SDA line if the SCL line stays low beyond the tTIMEOUT limit.
The time−out count is started (and then re−started) on every negative transition of SCL in the time interval between START and STOP. The
minimum clock frequency of 10 kHz is an SMBus recommendation; the minimum operating clock frequency for the CAT34TS02’s SPD
component is DC, while the minimum operating frequency for the TS component is limited only by the SMBus time−out. For the CAT34TS02
Rev. C, both the TS and the SPD implement the time−out feature.
6. In a “Wired−OR” system (such as I2C or SMBus), SDA rise time is determined by bus loading. Since each bus pull−down device must be
able to sink the (external) bus pull−up current (in order to meet the VIL and/or VOL limits), it follows that SDA fall time is inherently faster than
SDA rise time. SDA rise time can exceed the standard recommended tR limit, as long as it does not exceed tLOW − tDH − tSU:DAT, where tLOW
and tDH are actual values (rather than spec limits). A shorter tDH leaves more room for a longer SDA tR, allowing for a more capacitive bus
or a larger bus pull−up resistor. At the minimum tLOW spec limit of 1300 ns, the maximum tDH of 900 ns demands a maximum SDA tR of 300 ns.
The CAT34TS02’s maximum tDH is <700 ns, thus allowing for an SDA tR of up to 500 ns at minimum tLOW.
7. The minimum tSU:DAT of 100 ns is a limit recommended by standards. The CAT34TS02 will accept a tSU:DAT of 0 ns.
8. The first valid temperature recording can be expected after tPU at nominal supply voltage.
Table 6. PIN CAPACITANCE (TA = 25°C, VCC = 3.3 V, f = 1 MHz)
Symbol
Parameter
Test Conditions/Comments
Min
Max
Unit
CIN
SDA, EVENT Pin Capacitance
Input Capacitance (other pins)
VIN = 0
VIN = 0
8
pF
6
pF
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