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CAT34TS02_13 Datasheet, PDF (2/20 Pages) ON Semiconductor – Digital Output Temperature Sensor with On-board SPD EEPROM
CAT34TS02
Table 1. ABSOLUTE MAXIMUM RATINGS
Parameter
Rating
Units
Operating Temperature
−45 to +130
°C
Storage Temperature
−65 to +150
°C
Voltage on any pin (except A0) with respect to Ground (Note 1)
−0.5 to +6.5
V
Voltage on pin A0 with respect to Ground
−0.5 to +10.5
V
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. The DC input voltage on any pin should not be lower than −0.5 V or higher than VCC + 0.5 V. The A0 pin can be raised to a HV level for RSWP
command execution. SCL and SDA inputs can be raised to the maximum limit, irrespective of VCC.
Table 2. RELIABILITY CHARACTERISTICS (Note 3)
Symbol
Parameter
NEND (Note 2)
Endurance (EEPROM)
TDR
Data Retention (EEPROM)
2. Page Mode, VCC = 3.3 V, 25°C
Min
1,000,000
100
Units
Write Cycles
Years
Table 3. TEMPERATURE CHARACTERISTICS (VCC = 3.3 V ± 10%, TA = −20°C to +125°C, unless otherwise specified)
Parameter
Test Conditions/Comments
Max
Unit
Temperature Reading Error
Class B, JC42.4 compliant
ADC Resolution
+75°C ≤ TA ≤ +95°C, active range
+40°C ≤ TA ≤ +125°C, monitor range
−20°C ≤ TA ≤ +125°C, sensing range
±1.0
°C
±2.0
°C
±3.0
°C
12
Bits
Temperature Resolution
0.0625
°C
Conversion Time
100
ms
Thermal Resistance (Note 3) qJA
Junction−to−Ambient (Still Air)
92
°C/W
3. Power Dissipation is defined as PJ = (TJ − TA)/qJA, where TJ is the junction temperature and TA is the ambient temperature. The thermal
resistance value refers to the case of a package being used on a standard 2−layer PCB.
Table 4. D.C. OPERATING CHARACTERISTICS (VCC = 3.3 V ± 10%, TA = −20°C to +125°C, unless otherwise specified)
Symbol
Parameter
Test Conditions/Comments
Min
Max
Unit
ICC
Supply Current
TS active, SPD and Bus idle
SPD Write, TS shut−down
500
mA
500
mA
ISHDN
ILKG
VIL
VIH
VOL1
VOL2
Standby Current
I/O Pin Leakage Current
Input Low Voltage
Input High Voltage
Output Low Voltage
Output Low Voltage
TS shut−down; SPD and Bus idle
Pin at GND or VCC
IOL = 3 mA, VCC > 2.7 V
IOL = 1 mA, VCC < 2.7 V
10
mA
2
mA
−0.5
0.3 x VCC
V
0.7 x VCC
VCC + 0.5
V
0.4
V
0.2
V
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