2N5883 Datasheet, PDF (3/6 Pages) Mospec Semiconductor – POWER TRANSISTORS(25A,200W)

2N5883, 2N5884 (PNP) 2N5885, 2N5886 (NPN)
TURN−ON TIME
+2.0 V
10
0
R_B
t_r ≤
20 ns
−11 V
10 to 100 ms
DUTY CYCLE ≈ 2.0%
TURN−OFF TIME
+9.0 V
0
−11 V
t_r ≤ 20 ns
10 to 100 ms
DUTY CYCLE ≈ 2.0%
10
R_B
V_BB
V_CC −30 V
R_L 3.0
TO SCOPE
t_r ≤ 20 ns
V_CC −30 V
R_L 3.0
TO SCOPE
t_r ≤ 20 ns
+7.0 V
FOR CURVES OF FIGURES 3 & 6, R_B & R_L ARE VARIED.
INPUT LEVELS ARE APPROXIMATELY AS SHOWN.
FOR NPN, REVERSE ALL POLARITIES.
Figure 2. Switching Time Equivalent Test Circuits
2.0
1.0
0.7
0.5
0.3
0.2
0.1
0.07
0.05
0.03
0.02
0.3
T_J = 25°C
I_C/I_B = 10
V_CC = 30 V
V_BE(off) = 2 V
t_r
2N5883, 2N5884 (PNP)
t_d
2N5885, 2N5886 (NPN)
0.5 0.7 1.0
2.0 3.0 5.0 7.0 10
I_C, COLLECTOR CURRENT (AMPERES)
Figure 3. Turn−On Time
20 30
1.0
D = 0.5
0.5
0.2
0.2
0.1
0.1 _0.05
0.05 ^0.02
0.01
0.02 ^{SINGLE PULSE}
0.01
0.02
0.05 0.1 0.2
q_JC(t) = r(t) q_JC
P_(pk)
q_JC = 0.875°C/W MAX
D CURVES APPLY FOR POWER
PULSE TRAIN SHOWN
READ TIME AT t₁
T_J(pk) − T_C = P_(pk) q_JC(t)
t₁
t₂
DUTY CYCLE, D = t₁/t₂
0.5 1.0 2.0
5.0
10
20
50 100 200
t, TIME (ms)
Figure 4. Thermal Response
500 1000 2000
100
50
500 ms
20
1 ms
10
dc ^{5 ms}
5.0
T_J = 200°C
SECOND BREAKDOWN LIMITED
2.0
BONDING WIRE LIMITED
1.0
THERMAL LIMITATION @ T_C = 25°C
(SINGLE PULSE)
0.5 _{CURVES APPLY BELOW RATED VCEO}
0.2
0.1
1.0
2.0 3.0
2N5883, 2N5885
2N5884, 2N5886
5.0 7.0 10
20 30 50 70 100
V_CE, COLLECTOR−EMITTER VOLTAGE (VOLTS)
Figure 5. Active−Region Safe Operating Area
There are two limitations on the power handling ability of
a transistor: average junction temperature and second
breakdown. Safe operating area curves indicate I_C − V_CE
limits of the transistor that must be observed for reliable
operation; i.e., the transistor must not be subjected to greater
dissipation than the curves indicate.
The data of Figure 5 is based on T_J(pk) = 200°C; T_C is
variable depending on conditions. Second breakdown pulse
limits are valid for duty cycles to 10% provided T_J(pk)
v 200°C. T_J(pk) may be calculated from the data in
Figure 4. At high case temperatures, thermal limitations will
reduce the power that can be handled to values less than the
limitations imposed by second breakdown.
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