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NSS40300DDR2G Datasheet, PDF (2/6 Pages) ON Semiconductor – Dual 40 V, 6.0 A, Low VCE(sat) PNP Transistor
NSS40300DDR2G
THERMAL CHARACTERISTICS
Characteristic
Symbol
SINGLE HEATED
Total Device Dissipation (Note 1)
PD
TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 1)
Total Device Dissipation (Note 2)
TA = 25°C
Derate above 25°C
RqJA
PD
Thermal Resistance, Junction−to−Ambient (Note 2)
DUAL HEATED (Note 3)
RqJA
Total Device Dissipation (Note 1)
PD
TA = 25°C
Derate above 25°C
Thermal Resistance, Junction−to−Ambient (Note 1)
Total Device Dissipation (Note 2)
TA = 25°C
Derate above 25°C
RqJA
PD
Thermal Resistance, Junction−to−Ambient (Note 2)
RqJA
Junction and Storage Temperature Range
TJ, Tstg
1. FR−4 @ 10 mm2, 1 oz. copper traces, still air.
2. FR−4 @ 100 mm2, 1 oz. copper traces, still air.
3. Dual heated values assume total power is the sum of two equally powered devices.
Max
576
4.6
217
676
5.4
185
653
5.2
191
783
6.3
160
−55 to +150
Unit
mW
mW/°C
°C/W
mW
mW/°C
°C/W
mW
mW/°C
°C/W
mW
mW/°C
°C/W
°C
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