N25S818HA Datasheet, PDF (14/15 Pages) ON Semiconductor – 256Kb Low Power Serial SRAMs 32K × 8 bit Organization

N25S0818HA
8-Lead Plastic Thin Shrink Small Outline, 4.4 mm TSSOP
E
E1
p
D
B
α
A2
A1
A
φ
L
c
β
Parameter
Sym
Min
Pin Pitch
p
Overall height
A
Molded Package Thickness
A2
0.85
Standoff
A1
0.05
Overall Width
E
6.25
Molded Package Width
E1
4.30
Overall Length
D
2.90
Foot Length
L
0.50
Foot Angle
φ
0
Lead Thickness
c
0.09
Lead Width
B
0.19
Mold Draft Angle Top
α
0
Mold Draft Angle Bottom
β
0
Note:
1. All dimensions in Millimeters
2. Package dimensions exclude mold flash and protusions.
Nom
0.65
0.90
0.10
6.38
4.40
3.00
0.60
4
0.15
0.25
5
5
Max
1.10
0.95
0.15
6.50
4.50
3.10
0.70
8
0.20
0.30
10
10
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