N25S818HA Datasheet, PDF (13/15 Pages) ON Semiconductor – 256Kb Low Power Serial SRAMs 32K × 8 bit Organization

N25S0818HA
8-Lead Plastic Small Outline, 150mil SOIC
E
E1
p
D
B
45^o
A2
h
α
A1
A
φ
L
c
β
Parameter
Sym
Min
Pin Pitch
p
Overall height
A
1.35
Molded Package Thickness
A2
1.32
Standoff
A1
0.10
Overall Width
E
5.79
Molded Package Width
E1
3.71
Overall Length
D
4.80
Chamfer Distance
h
0.25
Foot Length
L
0.48
Foot Angle
φ
0
Lead Thickness
c
0.20
Lead Width
B
0.33
Mold Draft Angle Top
α
0
Mold Draft Angle Bottom
β
0
Note:
1. All dimensions in Millimeters
2. Package dimensions exclude mold flash and protusions.
Nom
1.27
1.55
1.42
0.18
6.02
3.91
4.90
0.38
0.62
4
0.23
0.42
12
12
Max
1.75
1.55
0.25
6.20
3.99
5.00
0.51
0.76
8
0.25
0.51
15
15
Rev. 9 | Page 13 of 15 | www.onsemi.com