CAV24C02_15 Datasheet, PDF (13/15 Pages) ON Semiconductor – 2-Kb, 4-Kb, 8-Kb and 16-Kb I2C CMOS Serial EEPROM

CAV24C02, CAV24C04, CAV24C08, CAV24C16
PACKAGE DIMENSIONS
WLCSP5, 0.86x0.84
CASE 567DD
ISSUE C
PIN A1
REFERENCE
E
ÈÈ
2X
0.10 C
AB
D
2X
0.10 C _{TOP VIEW}
0.10 C
A
A2
5X
0.05 C
NOTE 3
A1
SIDE VIEW
C
SEATING
PLANE
5X b
0.10 M C A B
C
NOTE 4
B
A
e
e1
PIN A1
123
REFERENCE
BOTTOM VIEW
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY THE
SPHERICAL CROWNS OF THE CONTACT BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM CON-
TACT BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A 0.29 0.39
A1 0.10 0.14
A2
0.23 REF
b 0.14 0.18
D
0.86 BSC
E
0.84 BSC
e
0.30 BSC
e1
0.52 BSC
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
0.52
PITCH
5X
0.16
0.30
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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