CAV24C02_15 Datasheet, PDF (12/15 Pages) ON Semiconductor – 2-Kb, 4-Kb, 8-Kb and 16-Kb I2C CMOS Serial EEPROM

CAV24C02, CAV24C04, CAV24C08, CAV24C16
PACKAGE DIMENSIONS
WLCSP4, 0.84x0.86
CASE 567DC
ISSUE D
E
PIN A1
ÈÈÈÈ REFERENCE
AB
D
2X
0.10 C
2X
0.10 C _{TOP VIEW}
* Die Coat
(Optional)
A3*
DETAIL A
0.10 C
A2
A
DETAIL A
0.05 C
NOTE 4
A1
SIDE VIEW
C
SEATING
PLANE
NOTE 3
A2
A
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DATUM C, THE SEATING PLANE, IS DEFINED BY
THE SPHERICAL CROWNS OF THE CONTACT
BALLS.
4. COPLANARITY APPLIES TO SPHERICAL CROWNS
OF THE CONTACT BALLS.
5. DIMENSION b IS MEASURED AT THE MAXIMUM
CONTACT BALL DIAMETER PARALLEL TO DATUM C.
MILLIMETERS
DIM MIN MAX
A 0.28 0.38
A1 0.08 0.12
A2
0.23 REF
A3* 0.025 REF
b 0.16 0.20
D
0.84 BSC
E
0.86 BSC
e
0.40 BSC
* Die Coat (Optional)
4X b
0.10 M C A B
B
NOTE 5
A
e
e
12
BOTTOM VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
0.40
PITCH
4X
0.18
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
12