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CM1235 Datasheet, PDF (12/14 Pages) ON Semiconductor – Small Footprint PicoGuard XS® ESD Clamp Array For High Speed Data Line Protection
CM1235
Mechanical Details
TDFN-16 Mechanical Specifications, 0.5mm
The 16-lead, 1.7x4.0mm, 0.5mm pitch TDFN package dimensions are presented below.
PACKAGE DIMENSIONS
Package
JEDEC
No.
Leads
TDFN
MO-229C*
16
Dim.
Millimeters
Inches
Min Nom Max Min Nom Max
A
0.70 0.75 0.80 0.028 0.030 0.031
A1
0.00 0.02 0.05 0.000 0.001 0.002
A3
0.175 0.200 0.225 0.007 0.008 0.009
b
0.20 0.25 0.30 0.008 0.010 0.012
D
3.90 4.00 4.10 0.153 0.157 0.161
D2
3.15 3.20 3.25 0.124 0.126 0.128
E
1.60 1.70 1.80 0.063 0.067 0.071
E2
0.45 0.50 0.55 0.018 0.020 0.022
e
0.50 BSC
0.020 BSC
K
0.30 REF
0.012 REF
L
0.25 0.30 0.35 0.010 0.012 0.014
# per
tape and
reel
3000 pieces
Controlling dimension: millimeters
*This package is compliant with JEDEC standard MO-229C with
the exception of the D, D2, E, E2, K and L dimensions as called
out in the table above.
Dimensions for 16-Lead, 0.5mm pitch
TDFN package
Rev. 3 | Page 12 of 14 | www.onsemi.com