SMBT35200MT1G Datasheet, PDF (1/5 Pages) ON Semiconductor – High Current Surface Mount PNP Silicon

MBT35200MT1
High Current Surface
Mount PNP Silicon
Switching Transistor
for Load Management
in Portable Applications
Features
• AEC−Q101 Qualified and PPAP Capable
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS (T_A = 25°C)
Rating
Symbol
Max
Unit
Collector-Emitter Voltage
Collector-Base Voltage
Emitter-Base Voltage
Collector Current − Continuous
Collector Current − Peak
Electrostatic Discharge
V_CEO
V_CBO
V_EBO
I_C
I_CM
ESD
−35
Vdc
−55
Vdc
−5.0
Vdc
−2.0
Adc
−5.0
A
HBM Class 3
MM Class C
THERMAL CHARACTERISTICS
Characteristic
Symbol
Max
Unit
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D (Note 1)
625
mW
5.0
mW/°C
Thermal Resistance,
Junction−to−Ambient
R_qJA (Note 1)
200
°C/W
Total Device Dissipation
T_A = 25°C
Derate above 25°C
P_D (Note 2)
1.0
W
8.0
mW/°C
Thermal Resistance,
Junction−to−Ambient
R_qJA (Note 2)
120
°C/W
Thermal Resistance,
Junction−to−Lead #1
R_qJL
°C/W
80
Total Device Dissipation
(Single Pulse < 10 sec.)
P_Dsingle
W
(Notes 2 & 3)
1.75
Junction and Storage
Temperature Range
T_J, T_stg
−55 to
°C
+150
Maximum ratings are those values beyond which device damage can occur.
Maximum ratings applied to the device are individual stress limit values (not
normal operating conditions) and are not valid simultaneously. If these limits are
exceeded, device functional operation is not implied, damage may occur and
reliability may be affected.
1. FR−4 @ Minimum Pad
2. FR−4 @ 1.0 X 1.0 inch Pad
3. ref: Figure 9
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
1
August, 2013 − Rev. 5
http://onsemi.com
35 VOLTS
2.0 AMPS
PNP TRANSISTOR
CASE 318G
TSOP−6
STYLE 6
COLLECTOR
1, 2, 5, 6
3
BASE
4
EMITTER
MARKING DIAGRAM
G4 MG
G
1
G4
= Specific Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
MBT35200MT1G
SMBT35200MT1G
Package
TSOP−6
(Pb−Free)
TSOP−6
(Pb−Free)
Shipping^†
3,000 /
Tape & Reel
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
Publication Order Number:
MBT35200MT1/D