PZT2222A Datasheet, PDF (1/5 Pages) NXP Semiconductors – NPN switching transistor

PZT2222A
NPN Silicon Planar
Epitaxial Transistor
This NPN Silicon Epitaxial transistor is designed for use in linear
and switching applications. The device is housed in the SOT−223
package which is designed for medium power surface mount
applications.
Features
• PNP Complement is PZT2907AT1
• The SOT−223 Package Can be Soldered Using Wave or Reflow
• SOT−223 Package Ensures Level Mounting, Resulting in Improved
Thermal Conduction, and Allows Visual Inspection of Soldered
Joints
• The Formed Leads Absorb Thermal Stress During Soldering,
Eliminating the Possibility of Damage to the Die
• Available in 12 mm Tape and Reel
• S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant*
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
(Open Collector)
V_CEO
40
Vdc
V_CBO
75
Vdc
V_EBO
6.0
Vdc
Collector Current
I_C
600
mAdc
Total Power Dissipation
up to T_A = 25°C (Note 1)
P_D
W
1.5
Storage Temperature Range°
T_stg
− 65 to +150
°C
Junction Temperature°
T_J
150
°C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Device mounted on an epoxy printed circuit board 1.575 inches x 1.575 inches x
0.059 inches; mounting pad for the collector lead min. 0.93 inches².
THERMAL CHARACTERISTICS
Rating
Symbol
Thermal Resistance,
Junction−to−Ambient
R_qJA
Lead Temperature for Soldering,
T_L
0.0625″ from case
Time in Solder Bath
Value
83.3
260
10
Unit
°C/W
°C
Sec
http://onsemi.com
SOT−223 PACKAGE
NPN SILICON TRANSISTOR
SURFACE MOUNT
4
123
SOT−223 (TO−261)
CASE 318E−04
STYLE 1
COLLECTOR
2, 4
BASE
1
3
EMITTER
MARKING DIAGRAM
AYM
P1FG
G
A
= Assembly Location
Y
= Year
M
= Month Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
Package
Shipping^†
PZT2222AT1G
SPZT2222AT1G
PZT2222AT3G
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
SOT−223
(Pb−Free)
1,000 Tape & Reel
1,000 Tape & Reel
4,000 Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting
Techniques Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
1
August, 2013 − Rev. 9
Publication Order Number:
PZT2222AT1/D