NSM46211DW6T1G Datasheet, PDF (1/4 Pages) ON Semiconductor – Dual NPN Transistors

NSM46211DW6T1G
Dual NPN Transistors
General Purpose NPN Transistor and
NPN Transistor with Monolithic Bias
Network
NSM46211DW6T1G contains a single NPN transistor with a single
NPN bias resistor transistor with a monolithic bias network; a series
base resistor and a base-emitter resistor. This device is designed to
replace multiple transistors and resistors on customer boards by
integrating these components into a single device.
NSM46211DW6T1G is housed in a SC-88/SOT-363 package
which is ideal for low power surface mount applications in space
constrained applications.
Features
•ăSimplifies Circuit Design
•ăReduces Board Space
•ăReduces Component Count
•ăQ1: NPN
•ăQ2: NPN BRT, R1 = R2 = 10 k (typical)
•ăThis is a Pb-Free Device
Applications
•ăLogic Switching
•ăAmplification
•ăDriver Circuits
•ăInterface Circuits
MAXIMUM RATINGS (T_A = 25°C unless otherwise noted, common for Q₁
and Q₂, - minus sign for Q₁ (PNP) omitted)
Rating - Q1 (NPN)
Symbol
Value
Unit
Collector‐Base Voltage
Collector‐Emitter Voltage
Emitter-Base Voltage
Collector Current - Continuous
Rating - Q2 (NPN BRT)
V_(BR)CBO
V_(BR)CEO
V_(BR)EBO
I_C
Symbol
ā80
ā65
6.0
100
Value
Vdc
Vdc
Vdc
mAdc
Unit
Collector‐Base Voltage
V_CBO
ā50
Vdc
Collector‐Emitter Voltage
V_CEO
ā50
Vdc
Collector Current
I_C
100
mAdc
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
http://onsemi.com
(3)
(2)
(1)
R₁
R₂
Q₁
Q₂
(4)
(5)
(6)
6
1
SC-88/SOT-363
CASE 419B
STYLE 1
MARKING DIAGRAM
6
N5 M G
G
1
N5
= Device Code
M
= Date Code*
G
= Pb-Free Package
(Note: Microdot may be in either location)
*Date Code orientation and/or position may
vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
Shipping^†
NSM46211DW6T1G SC-88 3000/Tape & Reel
(Pb-Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
©Ă Semiconductor Components Industries, LLC, 2008
1
February, 2008 - Rev. 0
Publication Order Number:
NSM46211DW6/D