NCN4555 Datasheet, PDF (1/12 Pages) ON Semiconductor – 1.8V / 3V SIM Card Power Supply and Level Shifter

NCN4555
1.8V / 3V SIM Card Power
Supply and Level Shifter
The NCN4555 is a level shifter analog circuit designed to translate
the voltages between a SIM Card and an external microcontroller or
MPU. A built−in LDO−type DC−DC converter makes the NCN4555
useable to drive 1.8 V and 3.0 V SIM card. The device fulfills the
ISO7816−3 smart card interface standard as well as GSM 11.11 and
related (11.12 and 11.18) and 3G mobile requirements (IMT−2000/3G
TS 31.101). With the STOP pin a low current shutdown mode can be
activated making the battery life longer. The Card power supply
voltage (SIM_V_CC) is selected using a single pin (MOD_V_CC).
Features
• Supports 1.8 V or 3.0 V Operating SIM Card
• The LDO is able to Supply More than 50 mA under 1.8 V and 3.0 V
• Built−in Pullup Resistor for I/O Pin in Both Directions
• All Pins are Fully ESD Protected According to ISO−7816
Specifications – ESD Protection on SIM Pins in Excess of 7 kV
(Human Body Model)
• Supports up to More than 5 MHz Clock
• Low−Profile 3x3 QFN−16 Package
• Pb−Free Packages are Available*
Typical Applications
• SIM Card Interface Circuit for 2G, 2.5G and 3G Mobile Phones
• Identification Module
• Smart Card Readers
• Wireless PC Cards
1.8 V to 5.5 V 2.7 V to 5.5 V
0.1mF 0.1mF
http://onsemi.com
QFN−16
MN SUFFIX
1
CASE 488AK
MARKING DIAGRAM
ÇÇÇÇÇÇ16
1
NCN
4555
ALYWG
G
A = Assembly Location
L = Wafer Lot
Y = Year
W = Work Week
G = Pb−Free Package
(Note: Microdot may be in either location)
V_BB
P3
P2
P1
P0
SIM Card
Detect
GND
GND
5
3 _VDD
1 _STOP
2 _{MOD_VCC}
14 _RST
SIM_V_CC ⁷
SIM_RST ⁹
1
2
3
4
V_CC GND
RST
CLK _I/O
C4 _C8
5
6
7
8
13 _CLK
15 _I/O
11
SIM_CLK
SIM_I/O ⁸
DET DET
1mF
GND
10
GND
Figure 1. Typical Interface Application
ORDERING INFORMATION
Device
Package
Shipping^†
NCN4555MN
QFN−16 123 Units / Rail
NCN4555MNG
QFN−16 123 Units / Rail
(Pb−Free)
NCN4555MNR2 QFN−16 3000/Tape & Reel
NCN4555MNR2G QFN−16 3000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2006
1
March, 2006 − Rev. 1
Publication Order Number:
NCN4555/D