MJF15030_13 Datasheet, PDF (1/6 Pages) ON Semiconductor – Complementary Power Transistors

MJF15030 (NPN),
MJF15031 (PNP)
Complementary Power
Transistors
For Isolated Package Applications
Designed for general−purpose amplifier and switching applications,
where the mounting surface of the device is required to be electrically
isolated from the heatsink or chassis.
Features
• Electrically Similar to the Popular MJE15030 and MJE15031
• No Isolating Washers Required, Reduced System Cost
• High Current Gain−Bandwidth Product
• UL Recognized, File #E69369, to 3500 V_RMS Isolation
• These Devices are Pb−Free and are RoHS Compliant*
MAXIMUM RATINGS
Rating
Symbol Value Unit
Collector−Emitter Voltage
Collector−Base Voltage
Emitter−Base Voltage
RMS Isolation Voltage (Note 1)
(t = 0.3 sec, R.H. ≤ 30%, T_A = 25_C)
Per Figure 11
V_CEO
V_CB
V_EB
V_ISOL
150
150
5
4500
Vdc
Vdc
Vdc
V_RMS
Collector Current − Continuous
I_C
Collector Current − Peak
I_CM
Base Current
I_B
Total Power Dissipation (Note 2) @ T_C = 25_C
P_D
Derate above 25_C
8
16
2
36
0.286
Adc
Adc
Adc
W
W/_C
Total Power Dissipation @ T_A = 25_C
Derate above 25_C
P_D
2.0
W
0.016 W/_C
Operating and Storage Temperature Range
THERMAL CHARACTERISTICS
T_J, T_stg –65 to +150 _C
Characteristic
Symbol
Max
Unit
Thermal Resistance, Junction−to−Ambient
R_qJA
62.5
_C/W
Thermal Resistance, Junction−to−Case (Note 2) R_qJC
3.5
_C/W
Lead Temperature for Soldering Purposes
T_L
260
_C
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
1. Proper strike and creepage distance must be provided.
2. Measurement made with thermocouple contacting the bottom insulated
surface (in a location beneath the die), the devices mounted on a heatsink with
thermal grease and a mounting torque of ≥ 6 in. lbs.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
© Semiconductor Components Industries, LLC, 2013
1
September, 2013 − Rev. 8
http://onsemi.com
COMPLEMENTARY SILICON
POWER TRANSISTORS
8 AMPERES
150 VOLTS, 36 WATTS
PNP
COLLECTOR 2, 4
NPN
COLLECTOR 2, 4
1
BASE
EMITTER 3
1
BASE
EMITTER 3
MARKING
DIAGRAM
1
2
3
TO−220 FULLPACK
CASE 221D
STYLE 2
MJF1503xG
AYWW
MJF1503x = Specific Device Code
x = 0 or 1
G
= Pb−Free Package
A
= Assembly Location
Y
= Year
WW
= Work Week
ORDERING INFORMATION
Device
Package
Shipping
MJF15030G
MJF15031G
TO−220 FULLPACK 50 Units/Rail
(Pb−Free)
TO−220 FULLPACK 50 Units/Rail
(Pb−Free)
Publication Order Number:
MJF15030/D