MBRM2H100T3G Datasheet, PDF (1/5 Pages) ON Semiconductor – Surface Mount Schottky Power Rectifier

MBRM2H100T3G,
NRVBM2H100T3G
Surface Mount
Schottky Power Rectifier
POWERMITE^®
Power Surface Mount Package
The Schottky Powermite^® employs the Schottky Barrier principle
with a barrier metal and epitaxial construction that produces optimal
forward voltage drop−reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the Powermite^® has the same thermal performance as the SMA while
being 50% smaller in footprint area. Because of its small size, it is
ideal for use in portable and battery powered products such as cellular
and cordless phones, chargers, notebook computers, printers, PDAs
and PCMCIA cards. Typical applications are AC−DC and DC−DC
converters, reverse battery protection, and “ORing” of multiple supply
voltages and any other application where performance and size are
critical.
Features
• Low Profile − Maximum Height of 1.1 mm
• Small Footprint − Footprint Area of 8.45 mm²
• Low V_F Provides Higher Efficiency and Extends Battery Life
• Supplied in 12 mm Tape and Reel
• Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
• NRV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements; AEC−Q101
Qualified and PPAP Capable
• This is a Pb−Free Device
Mechanical Characteristics:
• Powermite^® is JEDEC Registered as D0−216AA
• Case: Molded Epoxy
• Epoxy Meets UL 94 V−0 @ 0.125 in
• Weight: 16.3 mg (Approximately)
• Lead and Mounting Surface Temperature for Soldering Purposes:
260°C Maximum for 10 Seconds
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
2.0 AMPERES, 100 VOLTS
CATHODE
ANODE
POWERMITE
CASE 457
MARKING DIAGRAM
M
1
B2HG
2
M = Date Code
B2H = Device Code
G = Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping^†
MBRM2H100T3G Powermite 12000/Tape &
(Pb−Free)
Reel
NRVBM2H100T3G Powermite 12000/Tape &
(Pb−Free)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
January, 2014 − Rev. 2
Publication Order Number:
MBRM2H100/D