MBRM110ET1G Datasheet, PDF (1/5 Pages) ON Semiconductor – Surface Mount Schottky Power Rectifier

MBRM110ET1G,
NRVBM110ET1G
Surface Mount
Schottky Power Rectifier
POWERMITE^
Power Surface Mount Package
The Schottky POWERMITE^ employs the Schottky Barrier
principle with a barrier metal and epitaxial construction that produces
optimal forward voltage drop−reverse current tradeoff. The advanced
packaging techniques provide for a highly efficient micro miniature,
space saving surface mount Rectifier. With its unique heatsink design,
the POWERMITE^ has the same thermal performance as the SMA
while being 50% smaller in footprint area, and delivering one of the
lowest height profiles,  1.1 mm in the industry. Because of its small
size, it is ideal for use in portable and battery powered products such as
cellular and cordless phones, chargers, notebook computers, printers,
PDAs and PCMCIA cards. Typical applications are AC−DC and
DC−DC converters, reverse battery protection, and “ORing” of
multiple supply voltages and any other application where performance
and size are critical.
Features
 Low I_R Extends Battery Life
 Low Profile − Maximum Height of 1.1 mm
 Small Footprint − Footprint Area of 8.45 mm²
 150C Operating Junction Temperature
 Low Thermal Resistance with Direct Thermal Path of Die on
Exposed Cathode Heat Sink
 ESD Ratings:
 Human Body Model = 3B (> 16 kV)
 Machine Model = V (> 400 V)
 AEC−Q101 Qualified and PPAP Capable
 NRVB Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
 All Packages are Pb−Free*
Mechanical Characteristics:
 POWERMITE^ is JEDEC Registered as D0−216AA
 Case: Molded Epoxy
 Epoxy Meets UL 94 V−0 @ 0.125 in
 Weight: 16.3 mg (Approximately)
 Lead and Mounting Surface Temperature for Soldering Purposes:
260C Maximum for 10 Seconds
http://onsemi.com
SCHOTTKY BARRIER
RECTIFIER
1.0 AMPERES, 10 VOLTS
CATHODE
ANODE
POWERMITE
CASE 457
PLASTIC
MARKING DIAGRAM
M
1
1E1G
2
M = Date Code
1E1 = Device Code
G = Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping^†
MBRM110ET1G
NRVBM110ET1G
POWERMITE
(Pb−Free)
POWERMITE
(Pb−Free)
3,000 /
Tape & Reel
3,000 /
Tape & Reel
MBRM110ET3G
POWERMITE 12,000 /
(Pb−Free) Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please
download the ON Semiconductor Soldering and Mounting Techniques
Reference Manual, SOLDERRM/D.
 Semiconductor Components Industries, LLC, 2012
1
January, 2012 − Rev. 3
Publication Order Number:
MBRM110E/D