CM6114 Datasheet, PDF (1/4 Pages) ON Semiconductor – Single-Channel Transient Voltage Suppressor

CM6114
Advance Information
Single-Channel Transient
Voltage Suppressor
Product Description
The CM6114 is an Application Specific Integrated Passivet
(ASIPt) component in a 2 x 2, 4−bump, 0.4 mm pitch, CSP form
factor. This device is designed for:
• Fuse
• Transient Voltage Suppression (TVS)
• Electrostatic Discharge Protection
• Electrical Overstress Protection
Features
• 4−Bump, 0.8 mm X 0.8 mm Footprint Chip Scale Package (CSP)
• These Devices are Pb−Free and are RoHS Compliant
http://onsemi.com
WLCSP4
CASE 567CB
ELECTRICAL SCHEMATIC
Fuse
A1
A2
Table 1. PIN DESCRIPTIONS
4−bump CSP Package
Pin
Description
A1
Fuse Terminal 1
A2
TVS Channel / Fuse Terminal 2
B1 and B2 Device Ground
Orientation
Marking
A
B
PACKAGE / PINOUT DIAGRAMS
1
2
+
DX
2
1
A1
A A2 A1
B B2 B1
Orientation
Marking
Top View
(Bumps Down View)
Bottom View
(Bumps Up View)
X = Single Digit Date Code
4−Bump CSP Package
TVS
GND
B1 & B2
MARKING DIAGRAM
DX
D
= CM6114
X
= Single Digit Date Code
ORDERING INFORMATION
Device
Package
Shipping^†
CM6114
WLCSP4 10,000/Tape & Reel
(Pb−Free)
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
This document contains information on a new product. Specifications and information
herein are subject to change without notice.
© Semiconductor Components Industries, LLC, 2011
1
April, 2011 − Rev. P3
Publication Order Number:
CM6114/D