BCP53-16T3G Datasheet, PDF (1/5 Pages) ON Semiconductor – PNP Silicon Epitaxial Transistors

2N7002E
Small Signal MOSFET
60 V, 310 mA, Single, N−Channel, SOT−23
Features
• Low R_DS(on)
• Small Footprint Surface Mount Package
• Trench Technology
• These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
Applications
• Low Side Load Switch
• Level Shift Circuits
• DC−DC Converter
• Portable Applications i.e. DSC, PDA, Cell Phone, etc.
MAXIMUM RATINGS (T_J = 25°C unless otherwise stated)
Rating
Symbol Value Unit
Drain−to−Source Voltage
Gate−to−Source Voltage
Drain Current (Note 1)
Steady State
V_DSS
60
V
V_GS
±20
V
I_D
T_A = 25°C
T_A = 85°C
mA
260
190
t<5s
Power Dissipation (Note 1)
Steady State
t<5s
T_A = 25°C
T_A = 85°C
P_D
310
220
mW
300
420
Pulsed Drain Current (t_p = 10 ms)
Operating Junction and Storage
Temperature Range
I_DM
1.2
A
T_J, T_STG −55 to
°C
+150
Source Current (Body Diode)
I_S
300
mA
Lead Temperature for Soldering Purposes
T_L
260
°C
(1/8″ from case for 10 s)
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
THERMAL CHARACTERISTICS
Characteristic
Symbol Max Unit
Junction−to−Ambient − Steady State
(Note 1)
R_qJA
417 °C/W
Junction−to−Ambient − t ≤ 5 s (Note 1)
R_qJA
300
1. Surface−mounted on FR4 board using 1 in sq pad size (Cu area = 1.127 in
sq [1 oz] including traces)
http://onsemi.com
V_(BR)DSS
60 V
R_DS(on) MAX
3.0 W @ 4.5 V
2.5 W @ 10 V
I_D MAX
(Note 1)
310 mA
Simplified Schematic
N−Channel
3
1
2
(Top View)
MARKING DIAGRAM
& PIN ASSIGNMENT
3
Drain
3
1
2
SOT−23
CASE 318
STYLE 21
703 MG
G
1
Gate
2
Source
703 = Device Code
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
Device
2N7002ET1G
Package
SOT−23
(Pb−Free)
Shipping^†
3000/Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specifications
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2011
1
February, 2011 − Rev. 3
Publication Order Number:
2N7002E/D