BAV756S Datasheet, PDF (9/15 Pages) NXP Semiconductors – High-speed switching diode array

NXP Semiconductors
BAV756S; BAW56 series
High-speed switching diodes
10. Packing information
Table 9. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.^[1]
Type number Package Description
Packing quantity
3 000
10 000
BAV756S
SOT363 4 mm pitch, 8 mm tape and reel; T1
[2] _-115
-135
4 mm pitch, 8 mm tape and reel; T2
[3] _-125
-165
BAW56
SOT23
4 mm pitch, 8 mm tape and reel
-215
-235
BAW56M
SOT883 2 mm pitch, 8 mm tape and reel
-
-315
BAW56S
SOT363 4 mm pitch, 8 mm tape and reel; T1
[2] _-115
-135
4 mm pitch, 8 mm tape and reel; T2
[3] _-125
-165
BAW56T
SOT416 4 mm pitch, 8 mm tape and reel
-115
-135
BAW56W
SOT323 4 mm pitch, 8 mm tape and reel
-115
-135
[1] For further information and the availability of packing methods, see Section 14.
[2] T1: normal taping
[3] T2: reverse taping
11. Soldering
2.90
2.50
0.85
2
3.00 1.30
0.85
1
3
2.70
0.60
(3x)
solder lands
solder resist
solder paste
occupied area
Dimensions in mm
1.00
3.30
0.50 (3x)
0.60 (3x)
sot023
Fig 12. Reflow soldering footprint BAW56 (SOT23/TO-236AB)
BAV756S_BAW56_SER_5
Product data sheet
Rev. 05 — 26 November 2007
© NXP B.V. 2007. All rights reserved.
9 of 15