AN11689 Datasheet, PDF (9/18 Pages) NXP Semiconductors – Recommendations for PCB assembly of DSN1006

NXP Semiconductors
AN11689
Recommendations for PCB assembly of DSN1006
4. Solder stencil
4.1 Stencil recommendations
Due to small apertures and pad dimensions, use a high-quality stainless-steel stencil
manufactured by laser-cut and with electropolish or plasma coating.
The recommended stencil thickness is 100 m for the DSN1006 packages.
For the DSN1006-2 (SOD993) recommended NXP footprint (see Section 3.2.1, Figure 6),
the optimum stencil aperture is shown in Figure 8.
0.25
mm
0.5 mm
aaa-019081
Fig 8. Recommended stencil aperture for DSN1006-2 (SOD993)
AN11689
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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