AN11689 Datasheet, PDF (1/18 Pages) NXP Semiconductors – Recommendations for PCB assembly of DSN1006

AN11689
Recommendations for PCB assembly of DSN1006
Rev. 1 — 29 July 2015
Application note
Document information
Info
Content
Keywords
DSN1006, DSN1006-2, DSN1006U-2, SOD993, SOD995, 0402 package
size, reflow soldering, surface mount, solder paste, stencil aperture,
Printed-Circuit Board (PCB), Solder Mask Defined (SMD), footprint,
landing pattern, pick and place, Chip-Scale Package (CSP)
Abstract
This application note provides guidelines for board assembly of the
ultra-small DSN1006 (1.0  0.6 mm²) chip-scale package. The main focus
is on recommendations for reflow soldering.
For general information about footprint design and reflow soldering see
application note AN10365 (Surface mount reflow soldering description).