AN11689 Datasheet, PDF (15/18 Pages) NXP Semiconductors – Recommendations for PCB assembly of DSN1006

NXP Semiconductors
AN11689
Recommendations for PCB assembly of DSN1006
1.4
1.3
0.67
0.3
0.37
SOD995
0.6 0.5
(2x) (2x)
0.7 0.8
occupied area
solder lands
solder resist
solder paste
Dimensions in mm
0.5
0.6
15-02-09
15-02-20
0.37
0.47
0.13
sod995_fr
Recommended stencil thickness: 100 m
Fig 13. DSN1006U-2 (SOD995): solder footprint and stencil aperture
8.2 Further recommendations
8.2.1 Stencil layout and solder paste
• Stencil thickness of 100 m in combination with type 4 solder paste (refer to Table 2)
is recommended.
• A stencil aperture dimension as shown in Figure 8 and Figure 12 is recommended for
DSN1006-2 (SOD993).
• A stencil aperture dimension as shown in Figure 9 and Figure 13 is recommended for
DSN1006U-2 (SOD995).
• To get best printing (and soldering) results, control the cleaning cycle of the stencil.
8.2.2 Solder pad design
• Non-Solder Mask Defined (NSMD) pads with a gap between Cu pad and solder resist
of 50 m are recommended.
• Conductor (Cu trace) between solder pads on PCB is not recommended.
• Do not connect solder pads by -via.
• Connection by Cu traces (lines) is preferred.
AN11689
Application note
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 July 2015
© NXP Semiconductors N.V. 2015. All rights reserved.
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