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| LPC1850_13 Datasheet, PDF (85/149 Pages) NXP Semiconductors – 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller | |||
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NXP Semiconductors
LPC1850/30/20/10
32-bit ARM Cortex-M3 microcontroller
9. Thermal characteristics
The average chip junction temperature, Tj (ï°C), can be calculated using the following
equation:
Tj = Tamb + ï¨PD ï´ Rthï¨j â aï©ï©
(1)
⢠Tamb = ambient temperature (ï°C),
⢠Rth(j-a) = the package junction-to-ambient thermal resistance (ï°C/W)
⢠PD = sum of internal and I/O power dissipation
The internal power dissipation is the product of IDD(REG)(3V3) and VDD(REG)(3V3). The I/O
power dissipation of the I/O pins is often small and many times can be negligible. However
it can be significant in some applications.
Table 7. Thermal characteristics
Symbol
Parameter
Min
Typ
Max
Unit
Tj(max)
maximum junction
-
-
125
ï°C
temperature
Table 8.
Symbol
Rth(j-a)
Rth(j-c)
Thermal resistance (LQFP packages)
Parameter
Conditions
Thermal resistance
in ï°C/W ±15 %
LQFP144
thermal resistance from JEDEC (4.5 in ï´ 4 in); still air 38
junction to ambient
Single-layer (4.5 in ï´ 3 in); 50
still air
thermal resistance from
11
junction to case
Table 9.
Symbol
Rth(j-a)
Rth(j-c)
Thermal resistance value (BGA packages)
Parameter
Conditions
Thermal resistance in ï°C/W ±15 %
LBGA256
TFBGA180
TFBGA100
thermal resistance from JEDEC (4.5 in ï´ 4 in); still air 29
38
46
junction to ambient
8-layer (4.5 in ï´ 3 in); still air 24
30
37
thermal resistance from
junction to case
14
11
11
LPC1850_30_20_10
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6.1 â 7 February 2013
© NXP B.V. 2013. All rights reserved.
85 of 149
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