LPC1850_13 Datasheet, PDF (138/149 Pages) NXP Semiconductors – 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller

NXP Semiconductors
Footprint information for reflow soldering of TFBGA180 package
LPC1850/30/20/10
32-bit ARM Cortex-M3 microcontroller
SOT570-3
Hx
P
P
Hy
see detail X
Generic footprint pattern
Refer to the package outline drawing for actual layout
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
DIMENSIONS in mm
P
SL
SP
SR
Hx
Hy
0.80 0.400 0.400 0.550 12.575 12.575
Fig 53. Reflow soldering of the TFBGA180 package
SL
SP
SR
detail X
sot570-3_fr
LPC1850_30_20_10
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 6.1 — 7 February 2013
© NXP B.V. 2013. All rights reserved.
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