PZU13B2-115 Datasheet, PDF (8/12 Pages) NXP Semiconductors – Single Zener diodes in a SOD323F package Rev. 02 — 15 November 2009

NXP Semiconductors
8. Package outline
PZUxB series
Single Zener diodes in a SOD323F package
1.35
1.15
1
2.7 1.8
2.3 1.6
0.80
0.65
0.5
0.3
Dimensions in mm
2
0.40
0.25
Fig 5. Package outline SOD323F (SC-90)
0.25
0.10
04-09-13
9. Packing information
Table 10. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.^[1]
Type number Package Description
Packing quantity
3 000
10 000
PZU2.4B to SOD323F 4 mm pitch, 8 mm tape and reel
-115
-135
PZU36B
[1] For further information and the availability of packing methods, see Section 14.
10. Soldering
1.65 0.95
3.05
2.80
2.10
1.60
0.50 0.60
0.50
(2×)
001aab169
Fig 6.
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Reflow soldering footprint SOD323F (SC-90)
solder lands
solder resist
occupied area
solder paste
PZUXB_SER_2
Product data sheet
Rev. 02 — 15 November 2009
© NXP B.V. 2009. All rights reserved.
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