BAT46WH Datasheet, PDF (8/12 Pages) NXP Semiconductors – Single Schottky barrier diode

NXP Semiconductors
9. Package outline
BAT46WH
Single Schottky barrier diode
3.6 2.7
3.4 2.5
1.7
1.5
1
1.2
1.0
0.55
0.35
Dimensions in mm
Fig 12. Package outline SOD123F
2
0.70
0.55
0.25
0.10
04-11-29
10. Packing information
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.^[1]
Type number Package Description
BAT46WH
SOD123F 4 mm pitch, 8 mm tape and reel
Packing quantity
3 000
10 000
-115
-135
[1] For further information and the availability of packing methods, see Section 14.
11. Soldering
4.4
4
2.9
1.6
2.1 1.6
1.1 1.2
1.1
(2×)
Reflow soldering is the only recommended soldering method.
Dimensions in mm
Fig 13. Reflow soldering footprint SOD123F
solder lands
solder resist
solder paste
occupied area
BAT46WH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 November 2011
© NXP B.V. 2011. All rights reserved.
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