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BAT46WH Datasheet, PDF (3/12 Pages) NXP Semiconductors – Single Schottky barrier diode
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NXP Semiconductors
BAT46WH
Single Schottky barrier diode
Table 6.
Symbol
Rth(j-sp)
Thermal characteristics …continued
Parameter
Conditions
thermal resistance from
junction to solder point
Min Typ Max Unit
[4] -
-
25 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Device mounted on an FR4 PCB, single-sided copper, tin-plated, mounting pad for cathode 1 cm2.
[3] Reflow soldering is the only recommended soldering method.
[4] Soldering point of cathode tab.
103
Zth(j-a)
(K/W)
102
10
duty cycle =
1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
0.02
0.01
006aac394
0
1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, standard footprint
Fig 1. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
103
006aac395
Zth(j-a)
(K/W)
102
10
duty cycle =
1
0.75
0.5
0.33
0.25
0.2
0.1
0.05
0.02 0.01
0
1
10−5
10−4
10−3
10−2
10−1
1
10
102
103
tp (s)
FR4 PCB, mounting pad for cathode 1 cm2
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BAT46WH
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 28 November 2011
© NXP B.V. 2011. All rights reserved.
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