UJA1065 Datasheet, PDF (76/76 Pages) NXP Semiconductors – High-speed CAN/LIN fail-safe system basis chip

NXP Semiconductors
UJA1065
High-speed CAN/LIN fail-safe system basis chip
12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 68
13
Soldering of SMD packages . . . . . . . . . . . . . . 69
13.1
Introduction to soldering . . . . . . . . . . . . . . . . . 69
13.2
Wave and reflow soldering . . . . . . . . . . . . . . . 69
13.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 69
13.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 70
14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 72
15
Legal information. . . . . . . . . . . . . . . . . . . . . . . 73
15.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 73
15.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
15.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 73
15.4
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 74
16
Contact information. . . . . . . . . . . . . . . . . . . . . 74
17
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 75
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2010.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 25 February 2010
Document identifier: UJA1065_7