TDA8933 Datasheet, PDF (6/47 Pages) NXP Semiconductors – Class-D audio amplifier

NXP Semiconductors
TDA8933
Class-D audio amplifier
Table 3.
Symbol
HVP2
V_DDP2
BOOT2
OUT2
V_SSP2
STAB2
STAB1
V_SSP1
OUT1
BOOT1
V_DDP1
HVP1
OSCIO
V_SSD(HW)
Pinning description …continued
Pin
Description
19
half supply output voltage 2 for charging single-ended capacitor for
channel 2
20
positive power supply voltage for channel 2
21
bootstrap high-side driver channel 2
22
Pulse Width Modulated (PWM) output channel 2
23
negative power supply voltage for channel 2
24
decoupling of internal 11 V regulator for channel 2 drivers
25
decoupling of internal 11 V regulator for channel 1 drivers
26
negative power supply voltage for channel 1
27
PWM output channel 1
28
bootstrap capacitor for channel 1
29
positive power supply voltage for channel 1
30
half supply output voltage 1 for charging single-ended capacitor for
channel 1
31
oscillator input in slave configuration or oscillator output in master
configuration
32
negative digital supply voltage and handle wafer connection
8. Functional description
8.1 General
The TDA8933 is a mono full bridge or stereo half bridge audio power amplifier using
class-D technology. The audio input signal is converted into a Pulse Width Modulated
(PWM) signal via an analog input stage and PWM modulator. To enable the output power
Diffusion Metal Oxide Semiconductor (DMOS) transistors to be driven, this digital PWM
signal is applied to control and handshake block and driver circuits for both the high side
and low side. A 2nd-order-low-pass filter converts the PWM signal to an analog audio
signal across the loudspeakers.
The TDA8933 contains two independent half bridges with full differential input stages. The
loudspeakers can be connected in the following configurations:
• Mono full bridge: Bridge Tied Load (BTL)
• Stereo half bridge: Single-Ended (SE)
The TDA8933 contains circuits common to both channels, such as: the oscillator, all
reference sources, the mode functionality and a digital timing manager.
The following protections are built-in: thermal foldback, temperature, current and voltage.
TDA8933_1
Preliminary data sheet
Rev. 01 — 15 May 2007
© NXP B.V. 2007. All rights reserved.
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