TDA8933 Datasheet, PDF (18/47 Pages) NXP Semiconductors – Class-D audio amplifier

NXP Semiconductors
TDA8933
Class-D audio amplifier
10. Limiting values
Table 8. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
Max
Unit
V_P
supply voltage
asymmetrical supply
−0.3
+40
V
V_x
voltage on pin x
IN1P, IN1N, IN2P, IN2N
[1] _−5
+5
V
OSCREF, OSCIO, TEST
POWERUP, ENGAGE,
DIAG
[2] _{VSSD(HW) - 0.3 5}
V
[3] _{VCGND - 0.3 6}
V
I_ORM
all other pins
repetitive peak output
current
maximum output
current limiting
[4] _{VSS - 0.3}
[5] _2.3
V_DD + 0.3 V
-
A
T_j
T_stg
T_amb
junction temperature
storage temperature
ambient temperature
-
150
°C
−55
+150
°C
−40
+85
°C
P
power dissipation
-
5
W
[1] Measured with respect to pin INREF; V_x < V_DD + 0.3 V.
[2] Measured with respect to pin V_SSD(HW); V_x < V_DD + 0.3 V.
[3] Measured with respect to pin CGND; V_x < V_DD + 0.3 V.
[4] V_SS = V_SSP1 = V_SSP2; V_DD = V_DDP1 = V_DDP2.
[5] Current limiting concept.
11. Thermal characteristics
Table 9. Thermal characteristics
Symbol
Parameter
Conditions
Min
Typ
Max
R_th(j-a)
thermal resistance from
free air natural convection
junction to ambient
JEDEC test board
[1] _-
-
41
44
2 layer application board ^[2] -
44
-
Ψ_j-lead
thermal characterization
parameter from junction to
lead
-
-
30
Ψ_j-top
thermal characterization
parameter from junction to
top of package
[3] _-
-
8
[1] Measured in a JEDEC high K-factor test board (standard EIA/JESD 51-7) in free air with natural convection.
[2] 2 layer application board (55 mm × 45 mm), 35 µm copper, FR4 base material in free air with natural convection.
[3] Strongly dependent on where the measurement is taken on the package.
Unit
K/W
K/W
K/W
K/W
TDA8933_1
Preliminary data sheet
Rev. 01 — 15 May 2007
© NXP B.V. 2007. All rights reserved.
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