TDA8922C Datasheet, PDF (40/40 Pages) NXP Semiconductors – 2 X 75 W class-D power amplifier

NXP Semiconductors
TDA8922C
2 × 75 W class-D power amplifier
20. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
5
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
6
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
7.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
7.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5
8
Functional description . . . . . . . . . . . . . . . . . . . 5
8.1
8.2
8.3
8.3.1
8.3.1.1
8.3.1.2
8.3.2
8.3.3
8.3.4
8.4
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pulse-width modulation frequency . . . . . . . . . . 8
Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Thermal protection . . . . . . . . . . . . . . . . . . . . . . 8
Thermal FoldBack (TFB) . . . . . . . . . . . . . . . . . 8
OverTemperature Protection (OTP) . . . . . . . . . 9
OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
Window Protection (WP). . . . . . . . . . . . . . . . . 10
Supply voltage protection . . . . . . . . . . . . . . . . 11
Differential audio inputs . . . . . . . . . . . . . . . . . 11
9
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 12
10
Thermal characteristics. . . . . . . . . . . . . . . . . . 13
11
Static characteristics. . . . . . . . . . . . . . . . . . . . 13
12
Dynamic characteristics . . . . . . . . . . . . . . . . . 14
12.1
Switching characteristics . . . . . . . . . . . . . . . . 14
12.2
Stereo SE configuration characteristics . . . . . 15
12.3
Mono BTL application characteristics . . . . . . . 16
13
Application information. . . . . . . . . . . . . . . . . . 17
13.1
13.2
13.3
13.3.1
13.3.2
13.4
13.5
13.6
13.7
13.8
Mono BTL application . . . . . . . . . . . . . . . . . . . 17
Pin MODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Estimating the output power . . . . . . . . . . . . . . 17
Single-Ended (SE) . . . . . . . . . . . . . . . . . . . . . 17
Bridge-Tied Load (BTL) . . . . . . . . . . . . . . . . . 18
External clock . . . . . . . . . . . . . . . . . . . . . . . . . 18
Heatsink requirements . . . . . . . . . . . . . . . . . . 18
Pumping effects . . . . . . . . . . . . . . . . . . . . . . . 20
Application schematic . . . . . . . . . . . . . . . . . . . 21
Curves measured in reference design
(demonstration board) . . . . . . . . . . . . . . . . . . 23
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 33
15
Soldering of SMD packages . . . . . . . . . . . . . . 35
15.1
Introduction to soldering . . . . . . . . . . . . . . . . . 35
15.2
Wave and reflow soldering . . . . . . . . . . . . . . . 35
15.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 35
15.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 36
16
Soldering of through-hole mount packages . 37
16.1
Introduction to soldering through-hole
mount packages . . . . . . . . . . . . . . . . . . . . . . . 37
16.2
Soldering by dipping or by solder wave . . . . . 37
16.3
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 37
16.4
Package related soldering information . . . . . . 38
17
Revision history . . . . . . . . . . . . . . . . . . . . . . . 38
18
Legal information . . . . . . . . . . . . . . . . . . . . . . 39
18.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 39
18.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . 39
18.3
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . 39
18.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . 39
19
Contact information . . . . . . . . . . . . . . . . . . . . 39
20
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2009.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 7 September 2009
Document identifier: TDA8922C_1