PXT2222A Datasheet, PDF (4/10 Pages) NXP Semiconductors – NPN switching transistor

NXP Semiconductors
NPN switching transistor
Product data sheet
PXT2222A
THERMAL CHARACTERISTICS
SYMBOL
R_th(j-a)
PARAMETER
thermal resistance from junction to
ambient
R_th(j-s)
thermal resistance from junction to
soldering point
CONDITIONS
in free air
note 1
note 2
note 3
VALUE
UNIT
250
K/W
156
K/W
113
K/W
30
K/W
Notes
1. Device mounted on a printed-circuit board, single-sided copper, tin-plated and standard footprint.
2. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 1 cm².
3. Device mounted on a printed-circuit board, single-sided copper, tin-plated and mounting pad for collector 6 cm².
10³
Z_th
(K/W)
10²
(1)
(2)
(3)
(4)
(5)
(6)
(7)
10 ₍₈₎
(9)
(10)
006aaa235
1
10^−5
10^−4
10^−3
10^−2
10^−1
1
10
10²
10³
t_p (s)
Mounted on FR4 printed-circuit board; standard footprint.
(1) δ = 1.
(2) δ = 0.75.
(3) δ = 0.5.
(4) δ = 0.33.
(5) δ = 0.2.
(6) δ = 0.1.
(7) δ = 0.05.
(8) δ = 0.02.
(9) δ = 0.01.
(10) δ = 0.
Fig.3 Transient thermal impedance as a function of pulse time; typical values.
2004 Nov 22
4