PDTC144V Datasheet, PDF (4/11 Pages) NXP Semiconductors – NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ

NXP Semiconductors
PDTC144V series
NPN resistor-equipped transistors; R1 = 47 kΩ, R2 = 10 kΩ
5. Limiting values
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
V_CBO
collector-base voltage
open emitter
-
V_CEO
collector-emitter voltage open base
-
V_EBO
emitter-base voltage
open collector
-
V_I
input voltage
positive
-
negative
-
I_O
I_CM
P_tot
T_stg
T_j
T_amb
output current (DC)
peak collector current
total power dissipation
SOT416
SOT346
SOT883
SOT54
SOT23
SOT323
storage temperature
junction temperature
ambient temperature
-
-
T_amb ≤ 25 °C
T_amb ≤ 25 °C
T_amb ≤ 25 °C
T_amb ≤ 25 °C
T_amb ≤ 25 °C
T_amb ≤ 25 °C
[1] _-
[1] _-
[2][3] _-
[1] _-
[1] _-
[1] _-
−65
-
−65
Max
50
50
15
+40
−15
100
100
150
250
250
500
250
200
+150
150
+150
Unit
V
V
V
V
V
mA
mA
mW
mW
mW
mW
mW
mW
°C
°C
°C
[1] Refer to standard mounting conditions.
[2] Reflow soldering is the only recommended soldering method.
[3] Refer to SOT883 standard mounting conditions; FR4 printed-circuit board with 60 μm copper strip line.
6. Thermal characteristics
Table 7.
Symbol
R_th(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from in free air
junction to ambient
SOT416
SOT346
SOT883
SOT54
SOT23
SOT323
Min Typ
[1] _-
-
[1] _-
-
[2][3] _-
-
[1] _-
-
[1] _-
-
[1] _-
-
Max Unit
833
K/W
500
K/W
500
K/W
250
K/W
500
K/W
625
K/W
[1] Refer to standard mounting conditions.
[2] Reflow soldering is the only recommended soldering method.
[3] Refer to SOT883 standard mounting conditions; FR4 printed-circuit board with 60 μm copper strip line.
PDTC144V_SER_4
Product data sheet
Rev. 04 — 16 November 2009
© NXP B.V. 2009. All rights reserved.
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