PDTC123TE Datasheet, PDF (4/10 Pages) NXP Semiconductors – NPN resistor-equipped transistors; R1 = 2.2 killoohm, R2 = open

Philips Semiconductors
PDTC123T series
NPN resistor-equipped transistors; R1 = 2.2 kΩ, R2 = open
5. Limiting values
Table 6. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
V_CBO
collector-base voltage
open emitter
-
V_CEO
collector-emitter voltage
open base
-
V_EBO
emitter-base voltage
open collector
-
I_O
output current
-
I_CM
peak collector current
single pulse;
-
t_p ≤ 1 ms
P_tot
total power dissipation
T_amb ≤ 25 °C
SOT416
[1] _-
SOT346
[1] _-
SOT883
[2][3] _-
SOT54
[1] _-
SOT23
[1] _-
SOT323
[1] _-
T_stg
storage temperature
−65
T_j
junction temperature
-
T_amb
ambient temperature
−65
Max Unit
50
V
50
V
5
V
100
mA
100
mA
150
mW
250
mW
250
mW
500
mW
250
mW
200
mW
+150 °C
150
°C
+150 °C
[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard
footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
6. Thermal characteristics
Table 7.
Symbol
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
SOT416
SOT346
SOT883
SOT54
SOT23
SOT323
Conditions
in free air
Min Typ Max Unit
[1] _-
-
833 K/W
[1] _-
-
500 K/W
[2][3] _-
-
500 K/W
[1] _-
-
250 K/W
[1] _-
-
500 K/W
[1] _-
-
625 K/W
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
[3] Device mounted on an FR4 PCB with 60 µm copper strip line, standard footprint.
PDTC123T_SER_1
Product data sheet
Rev. 01 — 10 March 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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