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BYC8D-600 Datasheet, PDF (4/11 Pages) NXP Semiconductors – Hyperfast power diode Reduces switching losses in associated MOSFET
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NXP Semiconductors
BYC8D-600
Hyperfast power diode
5. Thermal characteristics
Table 5.
Symbol
Rth(j-mb)
Rth(j-a)
Thermal characteristics
Parameter
thermal resistance from junction to
mounting base
thermal resistance from junction to
ambient free air
Conditions
see Figure 3
in free air
Min Typ Max Unit
-
-
2.5 K/W
-
60
-
K/W
10
Zth(j-mb)
(K/W)
1
001aag913
10−1
P
tp
δ=
T
10−2
10−3
10−6
10−5
10−4
10−3
10−2
tp
T
10−1
t
1 10
tp (s)
Fig 3. Transient thermal impedance from junction to mounting base as a function of pulse width
BYC8D-600
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 01 — 27 December 2010
© NXP B.V. 2010. All rights reserved.
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