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BUK127-50DL Datasheet, PDF (4/11 Pages) NXP Semiconductors – PowerMOS transistor Logic level TOPFET
Philips Semiconductors
PowerMOS transistor
Logic level TOPFET
Product specification
BUK127-50DL
OVERLOAD PROTECTION CHARACTERISTICS
TOPFET switches off to protect itself when one of the overload thresholds is exceeded.
It remains latched off until reset by the input.
SYMBOL PARAMETER
CONDITIONS
MIN.
Overload protection
-40˚C ≤ Tj ≤ 150˚C
ID
Drain current limiting
VIS = 5 V
0.8
VIS = 4.5 V
0.7
VIS = 4 V to 5.5 V
0.6
TYP.
1.3
-
-
MAX. UNIT
1.7 A
-
A
1.8 A
PD(TO)
TDSC
Tj(TO)
Short circuit load protection VIS = 5 V
Overload power threshold
for protection to operate
-
17
-
W
Characteristic time
which determines trip time1
-
1.6
-
ms
Overtemperature protection from ID ≥ 280 mA or VDS ≥ 100 mV
Threshold junction temperature VIS = 4 V to 5.5 V
150 165 -
˚C
SWITCHING CHARACTERISTICS
Ta = 25˚C; resistive load RL = 50 Ω; adjust VDD to obtain ID = 250 mA; refer to test circuit and waveforms
SYMBOL PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
td on
Turn-on delay time
tr
Rise time
td off
Turn-off delay time
tf
Fall time
VIS: 0 V ⇒ 5 V
VIS: 5 V ⇒ 0 V
-
5
12 µs
-
11 30 µs
-
25 65 µs
-
14 35 µs
REVERSE DIODE LIMITING VALUE
SYMBOL PARAMETER
IS
Continuous forward current
CONDITIONS
Tmb ≤ 25 ˚C; VIS = 0 V
MIN.
-
MAX.
2
UNIT
A
REVERSE DIODE CHARACTERISTICS
Limits are for -40˚C ≤ Tmb ≤ 150˚C; typicals are for Tmb = 25˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
MIN.
VSDO
Forward voltage
IS = 2 A; VIS = 0 V; tp = 300 µs
-
trr
Reverse recovery time
not applicable2
-
TYP.
0.83
-
MAX. UNIT
1.1 V
-
-
1 Trip time td sc varies with overload dissipation PD according to the formula td sc ≈ TDSC / [ PD / PD(TO) - 1 ].
2 The reverse diode of this type is not intended for applications requiring fast reverse recovery.
October 2001
4
Rev 1.011