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| PSMN6R5-25YLC Datasheet, PDF (3/15 Pages) NXP Semiconductors – N-channel 25 V 6.5 mΩ logic level MOSFET in LFPAK using NextPower technology | |||
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NXP Semiconductors
PSMN6R5-25YLC
N-channel 25 V 6.5 m⦠logic level MOSFET in LFPAK using NextPower technology
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDS
VDGR
VGS
ID
Parameter
drain-source voltage
drain-gate voltage
gate-source voltage
drain current
IDM
peak drain current
Conditions
25 °C ⤠Tj ⤠175 °C
25 °C ⤠Tj ⤠175 °C; RGS = 20 kâ¦
VGS = 10 V; Tmb = 25 °C; see Figure 1
VGS = 10 V; Tmb = 100 °C; see Figure 1
pulsed; tp ⤠10 µs; Tmb = 25 °C;
see Figure 4
Ptot
total power dissipation
Tstg
storage temperature
Tj
junction temperature
Tsld(M)
peak soldering temperature
VESD
electrostatic discharge voltage
Source-drain diode
Tmb = 25 °C; see Figure 2
MM (JEDEC JESD22-A115)
IS
source current
ISM
peak source current
Avalanche ruggedness
Tmb = 25 °C
pulsed; tp ⤠10 µs; Tmb = 25 °C
EDS(AL)S
non-repetitive drain-source
avalanche energy
VGS = 10 V; Tj(init) = 25 °C; ID = 64 A;
Vsup ⤠25 V; unclamped; RGS = 50 â¦;
see Figure 3
Min Max Unit
-
25 V
-
25 V
-20 20 V
-
64 A
-
45 A
-
256 A
-
48 W
-55 175 °C
-55 175 °C
-
260 °C
240 -
V
-
44 A
-
256 A
-
18 mJ
80
ID
(A)
60
40
20
003aag135
120
Pder
(%)
80
40
03na19
0
0
50
100
150
200
Tmb (°C)
0
0
50
100
150
200
Tmb (°C)
Fig 1. Continuous drain current as a function of
mounting base temperature
Fig 2. Normalized total power dissipation as a
function of mounting base temperature
PSMN6R5-25YLC
Objective data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 â 12 July 2011
© NXP B.V. 2011. All rights reserved.
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