SSTUG32868 Datasheet, PDF (29/29 Pages) NXP Semiconductors – 1.8 V 28-bit 1 : 2 configurable registered buffer with parity for DDR2-1G RDIMM applications

NXP Semiconductors
SSTUG32868
1.8 V DDR2-1G configurable registered buffer with parity
18. Contents
1
General description . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
4.1
Ordering options . . . . . . . . . . . . . . . . . . . . . . . . 2
5
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 5
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 8
7
Functional description . . . . . . . . . . . . . . . . . . 10
7.1
Function table . . . . . . . . . . . . . . . . . . . . . . . . . 10
7.2
Functional information . . . . . . . . . . . . . . . . . . 11
7.3
Register timing . . . . . . . . . . . . . . . . . . . . . . . . 13
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 16
9
Recommended operating conditions. . . . . . . 16
10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 17
11
Test information . . . . . . . . . . . . . . . . . . . . . . . . 19
11.1
Parameter measurement information for data
output load circuit . . . . . . . . . . . . . . . . . . . . . . 19
11.2
Data output slew rate measurement . . . . . . . . 21
11.3
Error output load circuit and voltage
measurement . . . . . . . . . . . . . . . . . . . . . . . . . 22
12
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 24
13
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
13.1
Introduction to soldering . . . . . . . . . . . . . . . . . 25
13.2
Wave and reflow soldering . . . . . . . . . . . . . . . 25
13.3
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 25
13.4
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 26
14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 27
15
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 27
16
Legal information. . . . . . . . . . . . . . . . . . . . . . . 28
16.1
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 28
16.2
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
16.3
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
16.4
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
17
Contact information. . . . . . . . . . . . . . . . . . . . . 28
18
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [e-mail]
Date of release: 23 April 2007
Document identifier: SSTUG32868_1